<h1 class='color2'>Physical Vapor Deposition</h1><a href='index-2-kr.asp' class='link1'>click here</a>

<h1 class='color1'>Chemical Vapor Deposition</h1><a href='index-2-1-kr.asp' class='link1'>click here</a>

<h1 class='color3'>Chemical Mechanical Polishing</h1><a href='index-2-4-kr.asp' class='link1'>click here</a>

<h1 class='color4'>Etching System</h1><a href='index-2-2-kr.asp' class='link1'>click here</a>

<h1 class='color5'>Ashing System</h1><a href='index-2-3-kr.asp' class='link1'>click here</a>

<h1 class='color6'>Semiconduct Chemical</h1><a href='index-2-5-kr.asp' class='link1'>click here</a>

PVD

Varian XM-90
Varian-3000
Varian-M2000
Varian-M2i
Varian-MB²
Endura
Fronos

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CVD

Concept-One
Concept 2 Sequel
Concept 2 Altus
Concept 2 Speed
Ultima

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Etcher

E-MAX
Centura DPS

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Asher

L3510
PEP3510

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CMP

Chemical

Si Source
Ti Source
Zr Source
Hf Source
other Source

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Chemical Mechanical Polishing

EBARA EPO222

Wafer Grinding, Lapping & Polishing Equipment
Back & Front side deposition process
Module design
Dry-In / Dry-Out

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Mira Mesa

automated dry-in dry-out system
CMP robot, input shuttle and walking beam are the wafer handling mechanisms

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