Gasonics
Wafer size : 4" to 8"
Damage free process
Downstream Plasma
No metal grids between plasma tube and wafer

Gasonics
Wafer size : 6" to 8"
Damage-free downstream microwave 1.2kW source
Optical endpoint detection system
Dual blade wafer handler
Dual chamber processing
Platen and lamp wafer heating for process flexibility

Wafer Grinding, Lapping & Polishing Equipment
Back & Front side deposition process
Module design
Dry-In / Dry-Out

automated dry-in dry-out system
CMP robot, input shuttle and walking beam are the wafer handling mechanisms