Ashing System
L3510

Gasonics
Wafer size : 4" to 8"
Damage free process
Downstream Plasma
No metal grids between plasma tube and wafer
PEP3510

Gasonics
Wafer size : 6" to 8"
Damage-free downstream microwave 1.2kW source
Optical endpoint detection system
Dual blade wafer handler
Dual chamber processing
Platen and lamp wafer heating for process flexibility
Chemical Mechanical Polishing
EBARA EPO222

Wafer Grinding, Lapping & Polishing Equipment
Back & Front side deposition process
Module design
Dry-In / Dry-Out
Mira Mesa

automated dry-in dry-out system
CMP robot, input shuttle and walking beam are the wafer handling mechanisms