<h1 class='color2'>Physical Vapor Deposition</h1><a href='index-2.asp' class='link1'>click here</a>

<h1 class='color1'>Chemical Vapor Deposition</h1><a href='index-2-1.asp' class='link1'>click here</a>

<h1 class='color3'>Chemical Mechanical Polishing</h1><a href='index-2-4.asp' class='link1'>click here</a>

<h1 class='color4'>Etching System</h1><a href='index-2-2.asp' class='link1'>click here</a>

<h1 class='color5'>Ashing System</h1><a href='index-2-3.asp' class='link1'>click here</a>

<h1 class='color6'>Semiconduct Chemical</h1><a href='index-2-5.asp' class='link1'>click here</a>

PVD

Varian XM-90
Varian-3000
Varian-M2000
Varian-M2i
Varian-MB²
Endura
Fronos

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CVD

Concept-One
Concept 2 Sequel
Concept 2 Altus
Concept 2 Speed
Ultima

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Etcher

Asher/CMP

Asher

L3510
PEP3510

CMP

EBARA EPO222
Mira Mesa

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Chemical

Si Source
Ti Source
Zr Source
Hf Source
other Source

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Battery

FPD Equipments
Cell Equipments

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Etching System

E-MAX

Process: Poly Etch
Wafer Size : 8"
Electrostatic chuck (ESC)
Normal : 3 Chamber, Max : 4Chamber

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Centura DPS

Unibody Chamber
Chamber Liner
Diffusion Plasma Shield
STI Process Progress
WSix / Poly Etch simulaneously progress

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