Physical Vapor Deposition
Varian XM-90
Varian - Inline System
Back & Front side deposition process
Wafer Size : 4" to 6"
Versamag Source
Option : Etch, Deposition
Meterial : Al, Ti, Au, Ag, Ni, Cr, Va
Varian-3000 Series
Varian - Inline System
3180 / 3190 / 3280 / 3290
Wafer Size : 4" to 6"
ConMag & Quantum Source
Option : Etch, 3 Deposition, VIPS
Meterial : Al, Ti, TiW, Au, Ag
Varian-M2000
Varian - Cluster System
Wafer Size : 5" to 8"
Dual cassette loadlock
Option : Degas, Cool, Etch, Deposition, CDS Deposition
Meterial : Al, Ti, TiN, Tiw, Au
Varian-M2i
Varian - Cluster System
Wafer Size : 5" to 8"
Dual cassette loadlock
Option : Degas, Cool, Etch, Deposition, CDS Deposition
Meterial : Al, Ti, TiN, Tiw, Au
Endura
AMAT - Cluster System
Wafer Size : 6" to 8"
ConMag & Quantum Source
Option : Robot arm, Loadlock body, Degas,
Cool, Pre-II, IMP, CDS Deposition,
SIP, Heater, E-chuck (Lo/Hi temp)
Meterial : Al, Ti, TiN, TiW, WSi, MOCVD
Fronos
Maestech - Inline System
Wafer Size : 6" to 8"
Back & Front side deposition process
Option : Etch, Deposition
Meterial : Al, Ti, Au, Ag, Ni, Cr, Va